XC3S50A-4FTG256C IC FPGA 144 I/O 256FTBGA Field Programmable Gate Array
XC3S50A-4FTG256C
Products Description:
Very low cost, high-performance logic solution for high-volume, cost-conscious applications • Dual-range VCCAUX supply simplifies 3.3V-only design • Suspend, Hibernate modes reduce system power • Multi-voltage, multi-standard SelectIO™ interface pins • Up to 502 I/O pins or 227 differential signal pairs • LVCMOS, LVTTL, HSTL, and SSTL single-ended I/O • 3.3V, 2.5V, 1.8V, 1.5V, and 1.2V signaling • Selectable output drive, up to 24 mA per pin • QUIETIO standard reduces I/O switching noise • Full 3.3V ± 10% compatibility and hot swap compliance • 640+ Mb/s data transfer rate per differential I/O • LVDS, RSDS, mini-LVDS, HSTL/SSTL differential I/O with integrated differential termination resistors • Enhanced Double Data Rate (DDR) support • DDR/DDR2 SDRAM support up to 400 Mb/s • Fully compliant 32-/64-bit, 33/66 MHz PCI® technology support • Abundant, flexible logic resources • Densities up to 25,344 logic cells, including optional shift register or distributed RAM support • Efficient wide multiplexers, wide logic • Fast look-ahead carry logic • Enhanced 18 x 18 multipliers with optional pipeline • IEEE 1149.1/1532 JTAG programming/debug port • Hierarchical SelectRAM™ memory architecture • Up to 576 Kbits of fast block RAM with byte write enables for processor applications • Up to 176 Kbits of efficient distributed RAM • Up to eight Digital Clock Managers (DCMs) • Clock skew elimination (delay locked loop) • Frequency synthesis, multiplication, division • High-resolution phase shifting • Wide frequency range (5 MHz to over 320 MHz) • Eight low-skew global clock networks, eight additional clocks per half device, plus abundant low-skew routing • Configuration interface to industry-standard PROMs • Low-cost, space-saving SPI serial Flash PROM • x8 or x8/x16 BPI parallel NOR Flash PROM • Low-cost Xilinx® Platform Flash with JTAG • Unique Device DNA identifier for design authentication • Load multiple bitstreams under FPGA control • Post-configuration CRC checking • Complete Xilinx ISE® and WebPACK™ development system software support plus Spartan-3A Starter Kit • MicroBlaze™ and PicoBlaze embedded processors • Low-cost QFP and BGA packaging, Pb-free options • Common footprints support easy density migration • Compatible with select Spartan-3AN nonvolatile FPGAs • Compatible with higher density Spartan-3A DSP FPGAs • XA Automotive version available
Technological Parameters:
| category | Integrated Circuit (IC) |
| manufacturer | AMD |
| series | Spartan®-3A |
| LAB/CLB | 176 |
| Number of logical elements/units | 1584 |
| Total RAM bits | 55296 |
| I/O count | 144 |
| Number of gates | 50000 |
| Voltage - Power Supply | 1.14V ~ 1.26V |
| Installation type | Surface mount type |
| operation temperature | 0°C ~ 85°C(TJ) |
| Supplier Device Packaging | 256-FTBGA(17x17) |
Customer Service:
1. Do you support BOM lists?
Of course, we have a professional team to provide BOM.
2. Shown below. Behind MOQ?
Our MOQ is flexible and can be provided according to your needs, with a minimum of 10 pieces.
3. What about lead time?
After receiving the deposit, we will arrange to pack the goods and contact logistics for delivery. The duration is 3-7 days.
4. Our advantage?
1. Stable and sufficient supply
2. Competitive pricing
3. Rich BOM experience
4. Perfect after-sales service
5. Professional test certificate
5. Our service?
Payment methods :T/T, L/C, D/P, D/A, MoneyGram, Credit Card, paypal, Western Union, Cash, Escrow, Alipay...
6. Transportation:
DHL, TNT, FedEx, EMS, DEPX, Air, Sea Shipping
Product Photos:
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